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| Thesis Name： |
Addition curing type silicone resin composition |
| Usage： |
chemical industry |
| Keyword： |
Addition curing type silicone resin composition |
| Remarks： |
An addition curing type silicone resin composition is provided including (A) 100 parts by weight of a specific organopolysiloxane with a phenyl group and at least two alkenyl groups within each molecule, (B) 1 to 100 parts by weight of a specific organohydrogenpolysiloxane with a phenyl group and at least two SiH groups within each molecule, and (C) an effective quantity of a hydrosilylation reaction catalyst. A cured product obtained by curing this composition is transparent, displays good strength and particularly good flexural strength, and moreover also displays a high degree of hardness. The composition is applicable to a variety of fields including electrical and electronic equipment, OA equipment and precision instruments. |
| Original file： |
No File
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Promulgator Detail |
| Full name: |
hichem |
| Country: |
CN |
| City: |
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| Company Name: |
hichem |
| Homepage: |
http://www.teloon.com |
| E-mail: |
reply |
| Phone: |
86-411-82819585 |
| Fax: |
86-411-82819612 |
| Company Address: |
Renming Road, Dalian city, Lianning pro,china |
| Zip/Postal Code: |
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| Introduction: |
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