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| Thesis Name： |
Curing and thermal property of boron-containing o-cresol formaldehyde resin |
| Usage： |
chemistry |
| Keyword： |
Boron-containing phenol-formaldehyde resin, o-cresol, Boric acid, Thermal analysis |
| Remarks： |
Abstract The curing and thermal degradation process of boron-containing o-cresol formaldehyde resin (BOCNR) was studied by infrared spectroscopy (IR) and thermogravimetry analysis (TGA). The results show that hexatomic ring containing coordinate linkage of boron-oxygen formed in the curing process of BOCNR, and the coordinated oxygen atom was offered by phenol hydroxyl. TGA results show that BOCNR have good thermostability and its degradation processes can be divided into three stages. In the second and third stages, the decomposition reactions are all following first mechanism function.
Xia Liya, Gao Jungang, Yu Zhenxia
(Supervision Institution of Quality&Technology, College of Chemistry and Environmental Science, Hebei University, Baoding 071002, China) |
| Original file： |
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